Although IBM, in its discretion, may have periodically provided updates, patches, or fixes to the hardware's machine code (for example, microcode or firmware), IBM will no longer provide any such updates, patches, or fixes (including those designed to address security).įor a list of affected products and effective dates, see the Description section. IBM will continue to provide hardware maintenance support services under the terms of existing agreements.
Periodically, IBM provides notice to customers of plans to terminate new defect support for IBM and original equipment manufacturer (OEM) machines under an IBM Agreement. The Datacon 2200 evoplus die bonder for Multi Module Attach Datacon 2200 evo goes PLUS VISION. For a list of affected products and effective dates, see the Description section. If available, clients will continue to receive limited hardware maintenance service as described in the "Withdrawal" section of your terms with IBM, without lapse in coverage, for select machine types.
Datacon 2200 evo The Datacon 2200 evo high-accuracy multi-chip die bonder.
IBM will send no further correspondence of this nature for these machine types, models, features, or RPQs.Īfter the effective date, IBM will no longer offer full hardware maintenance service for the listed machine types. Sale Advanced Code Evo identifies, unlocks, copies and generates Philips. At this time, we are providing notice that selected machine types, models, and features will be discontinued from maintenance services. The main manufacturers of Bonder are Esec, ASM, West Bond, K & S, Kulicke and Soffa (K&S), EVG, Orthodyne, KNS, Westbond, Alphasem, Dage, Delvotec, Mech-El, Hesse, Alessi, Benchmark, Cedal, CMI (Coating Measuring Industries), Datacon, Disco, DNS Dpveen, Dynatex, Ewald Instruments,F&K Delvotec, Hesse & Knipps,Hesse, Hughes, Hybond, HyperVision, Karl Suss, Kulicke and Soffa (K&S), Laurier, Logitech, MBS, MEI, MRSI, Mullen, OAI, Optima, Palomar, Pesl, Research Device Automation, Research Devices, Royce, SEC, Semiconductor Equipment Corporation (SEC), Shinkawa, Suss, TEL, Tosok, TPT, Tresky, Ultron, Unitek.
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